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A practical assessment of current plastic encapsulated microelectronic devices
Author(s) -
Hughes John
Publication year - 1989
Publication title -
quality and reliability engineering international
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.913
H-Index - 62
eISSN - 1099-1638
pISSN - 0748-8017
DOI - 10.1002/qre.4680050206
Subject(s) - microelectronics , reliability (semiconductor) , quality assurance , plastic packaging , quality (philosophy) , reliability engineering , work (physics) , variety (cybernetics) , computer science , engineering , telecommunications , risk analysis (engineering) , manufacturing engineering , electrical engineering , mechanical engineering , business , operations management , power (physics) , physics , external quality assessment , philosophy , artificial intelligence , epistemology , quantum mechanics
The use of plastic encapsulated devices (PEDs) for a variety of market sectors has been the subject of much discussion over the past two decades. The advantages of lower cost together with the inherent mechanical ruggedness of these non‐cavity packages have been weighed against the concerns over quality and reliability and, in particular, electrical operation at extremes of temperature. This paper presents the results of some practical work undertaken on a modern LSI device in a plastic leaded chip carrier package. It then discusses British Telecom's experience with PEDs to date and concludes with some general considerations on the quality assurance requirements a purchaser may place on vendors of such devices.