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Reliability of plastic‐encapsulated logic circuits
Author(s) -
Olsson Christer
Publication year - 1989
Publication title -
quality and reliability engineering international
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.913
H-Index - 62
eISSN - 1099-1638
pISSN - 0748-8017
DOI - 10.1002/qre.4680050111
Subject(s) - reliability engineering , reliability (semiconductor) , service life , electronic circuit , accelerated life testing , engineering , computer science , electrical engineering , statistics , mathematics , weibull distribution , power (physics) , physics , quantum mechanics
Families of plastic‐encapsulated logic circuits have been subjected to a qualification procedure. The aim was to qualify them for use in telecommunication equipment in a central office environment. The qualification was based on a large number of reliability tests performed by the Ericsson failure analysis laboratory and by the vendors themselves. Reliability monitoring data from the testing of more than 150,000 devices during the period 1984 to 1985 have been analysed. Life tests, such as ‘high temperature operating life’, ‘high humidity operating life’, and temperature cycling have been performed. A comparison between life‐test data and field data from telephone exchanges in service has also been made. An average activation energy of 0.5 eV has been shown to be useful in such a comparison for the best LS vendors and 0.3 eV for the best HCMOS vendors.