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Early life failures
Author(s) -
Unger Burton A.
Publication year - 1988
Publication title -
quality and reliability engineering international
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.913
H-Index - 62
eISSN - 1099-1638
pISSN - 0748-8017
DOI - 10.1002/qre.4680040109
Subject(s) - reliability engineering , reliability (semiconductor) , event (particle physics) , electrostatic discharge , engineering , computer science , forensic engineering , physics , electrical engineering , voltage , power (physics) , quantum mechanics
Device failures can be classified as event‐dependent, time‐dependent, and a combination of the two, event/time‐dependent failures. Early life failure are dominated by event‐dependent failures, i.e. Electrostatic Discharge (ESD) failures, and mechanical failures (bonds, cracks, etc.) that result from a stress event. Test and failure analysis results supporting the above are reviewed. This paper was presented at the 1985 Semiconductor Device Reliability NATO Workshop.