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A mechanical decapsulation technique for epoxide‐packaged semiconductor components
Author(s) -
Chwastek E. J.,
Holland I. A.
Publication year - 1988
Publication title -
quality and reliability engineering international
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.913
H-Index - 62
eISSN - 1099-1638
pISSN - 0748-8017
DOI - 10.1002/qre.4680040106
Subject(s) - semiconductor , materials science , corrosion , semiconductor device , mechanical strength , composite material , mechanical engineering , metallurgy , engineering drawing , optoelectronics , engineering , layer (electronics)
A novel mechanical technique for decapsulating plastic semiconductor components has been developed. The technique is extremely easy to use, has a high success rate, and is superior in all respects to previously‐described mechanical techniques which give inconsistent results. A significant advantage over alternative chemical techniques is that corrosion products on the die surface are retained. This paper describes the new technique and shows examples of new and corroded components that have been successfully decapsulated.