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(LCCs) R & M Implications of leadless chip carriers
Author(s) -
Fox H. E.
Publication year - 1987
Publication title -
quality and reliability engineering international
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.913
H-Index - 62
eISSN - 1099-1638
pISSN - 0748-8017
DOI - 10.1002/qre.4680030106
Subject(s) - reliability (semiconductor) , reliability engineering , chip , computer science , engineering , electrical engineering , physics , thermodynamics , power (physics)
The current state‐of‐the‐art regarding LCCs is reviewed in terms of published papers concerning LCC applications, device reliability and attachment techniques. Reliability uncertainties relating to environment, size and attachment geometry are identified. An extensive bibliography is included.