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The reliability engineer looks at stress screening
Author(s) -
Tustin Wayne
Publication year - 1985
Publication title -
quality and reliability engineering international
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.913
H-Index - 62
eISSN - 1099-1638
pISSN - 0748-8017
DOI - 10.1002/qre.4680010307
Subject(s) - reliability (semiconductor) , stress (linguistics) , shock (circulatory) , engineering , reliability engineering , mechanical engineering , structural engineering , burn in , electronics , forensic engineering , vibration , manufacturing engineering , computer science , materials science , electrical engineering , acoustics , medicine , physics , linguistics , philosophy , power (physics) , quantum mechanics
Stress screening (as a final step in the manufacture of electronics) adds brief intervals of severe broadband vibration to temperature shock. The goal is to precipitate as hard defects any latent manufacturing defects. Applying such stressing to subassemblies and assemblies is much faster and much more effective than the more familiar ‘burn‐in’ or temperature shock alone.