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Reliability of plastic‐encapsulated integrated circuits in moisture environments
Author(s) -
Gallace L.,
Rosenfield M.
Publication year - 1985
Publication title -
quality and reliability engineering international
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.913
H-Index - 62
eISSN - 1099-1638
pISSN - 0748-8017
DOI - 10.1002/qre.4680010209
Subject(s) - reliability (semiconductor) , moisture , reliability engineering , process (computing) , computer science , identification (biology) , process engineering , engineering , environmental science , materials science , power (physics) , physics , quantum mechanics , composite material , operating system , botany , biology
An overview of the factors affecting the reliability of plastic‐encapsulated ICs in moisture environments is presented. Particular attention is given to the moisture‐related failure mechanism EMA (electrolytic metal attack). The package design and process steps and techniques developed at RCA (through identification of the proper analytical models, thorough engineering programs, and by the statistical design of experiments) are detailed. Particular attention was paid to eliminating chlorides and their sources. The nature and state of ongoing plastic‐package moisture‐resistance programmes and future expectations are described.