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Reducing mold changing time by implementing Lean Six Sigma
Author(s) -
Lee KuoLiang,
Wei ChunChin
Publication year - 2010
Publication title -
quality and reliability engineering international
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.913
H-Index - 62
eISSN - 1099-1638
pISSN - 0748-8017
DOI - 10.1002/qre.1069
Subject(s) - six sigma , lean six sigma , dmaic , manufacturing engineering , lean manufacturing , design for six sigma , lean laboratory , mold , lean project management , process (computing) , engineering , control (management) , quality (philosophy) , operations management , computer science , process management , programming language , software construction , philosophy , operating system , software , epistemology , artificial intelligence , biology , software system , genetics
Six Sigma is a well‐structured methodology that focuses on reducing variation, measuring defects and improving the quality of products, processes and services. Lean Production is an approach that focuses on reducing the cycle time and eliminating waste in processes. Combining the principles of Six Sigma and Lean can achieve synergistic results that neither system can achieve alone. This paper presents a case study at a printed circuit board company in China illustrating how the company effectively applied a Lean Six Sigma project. The mold changing time in In‐circuit test process is examined. Numerous improvement actions and a control plan are developed and implemented to sustain and enhance the efficiency of the mold changing process. Finally, the benefits, experience and extensions of the Lean Six Sigma project are also discussed. Copyright © 2009 John Wiley & Sons, Ltd.