Surface hydrophobic modification of chitosan thin films by hexamethyldisilazane plasma deposition: effects on water vapour, CO 2  and O 2  permeabilities | Zendy

Assis Odilio B. G. | Zendy; Hotchkiss Joseph H. | Zendy

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Surface hydrophobic modification of chitosan thin films by hexamethyldisilazane plasma deposition: effects on water vapour, CO 2 and O 2 permeabilities

Author(s) -

Assis Odilio B. G.,

Hotchkiss Joseph H.

Publication year - 2007

Publication title -

packaging technology and science

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.365

H-Index - 50

eISSN - 1099-1522

pISSN - 0894-3214

DOI - 10.1002/pts.766

Subject(s) - contact angle , chemical engineering , materials science , wetting , thin film , coating , fourier transform infrared spectroscopy , deposition (geology) , chitosan , chemical vapor deposition , water vapor , plasma enhanced chemical vapor deposition , surface modification , chemistry , composite material , nanotechnology , organic chemistry , paleontology , sediment , engineering , biology

This study evaluated the effects of the deposition of a thin hydrophobic silicon coating onto a polysaccharide film's surface. The goal was to improve the water vapour barrier of the hydrophilic film in order to increase the film's usefulness in packaging applications. A cold‐plasma technique was used to create a thin hexamethyldisilazane deposition on a chitosan film surface. The modification was investigated using Fourier transform infrared. The effect on the surface was characterized through contact angle measurements and degree of swelling. A significant reduction in hydrophilicity and water vapour permeability was observed. Gas barrier measurements indicated that there were no substantial differences in O 2 and CO 2 permeabilities under the conditions used in this investigation. Copyright © 2007 John Wiley & Sons, Ltd.

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