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Surface hydrophobic modification of chitosan thin films by hexamethyldisilazane plasma deposition: effects on water vapour, CO 2 and O 2 permeabilities
Author(s) -
Assis Odilio B. G.,
Hotchkiss Joseph H.
Publication year - 2007
Publication title -
packaging technology and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.365
H-Index - 50
eISSN - 1099-1522
pISSN - 0894-3214
DOI - 10.1002/pts.766
Subject(s) - contact angle , chemical engineering , materials science , wetting , thin film , coating , fourier transform infrared spectroscopy , deposition (geology) , chitosan , chemical vapor deposition , water vapor , plasma enhanced chemical vapor deposition , surface modification , chemistry , composite material , nanotechnology , organic chemistry , paleontology , sediment , engineering , biology
This study evaluated the effects of the deposition of a thin hydrophobic silicon coating onto a polysaccharide film's surface. The goal was to improve the water vapour barrier of the hydrophilic film in order to increase the film's usefulness in packaging applications. A cold‐plasma technique was used to create a thin hexamethyldisilazane deposition on a chitosan film surface. The modification was investigated using Fourier transform infrared. The effect on the surface was characterized through contact angle measurements and degree of swelling. A significant reduction in hydrophilicity and water vapour permeability was observed. Gas barrier measurements indicated that there were no substantial differences in O 2 and CO 2 permeabilities under the conditions used in this investigation. Copyright © 2007 John Wiley & Sons, Ltd.