Premium
Practical mathematical model to predict the performance of insulating packages
Author(s) -
Choi SeungJin,
Burgess Gary
Publication year - 2007
Publication title -
packaging technology and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.365
H-Index - 50
eISSN - 1099-1522
pISSN - 0894-3214
DOI - 10.1002/pts.762
Subject(s) - thermal conduction , thermal resistance , thermal , heat transfer , thermal insulation , materials science , convection , mechanical engineering , penetration (warfare) , mechanics , engineering , composite material , thermodynamics , physics , layer (electronics) , operations research
Thermal insulation is used in a variety of applications to protect temperature‐sensitive products from thermal damage. Several factors affect the performance of insulating packages. These factors include the packaging material, the geometry of the package, the geometry of the product, and the degree of contact between the product and the package. In this study, a comprehensive model which includes all of these factors was developed to predict the performance of the insulating package. First, an equation was derived for the calculation of the thermal resistance of a multilayered wall. The wall resistance was then used in a mathematical model which included the aforementioned factors. Basic heat transfer principles covering conduction, convection and radiation were applied to the model and the package heat penetration rate was calculated. Based on this model, several factors affecting the performance of the insulating package were discussed. Examples of the use of this model for ice requirement calculations were also included. Copyright © 2007 John Wiley & Sons, Ltd.