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Predicting and determining the bending stiffness of thin films and laminates
Author(s) -
Wyser Y.,
Pelletier C.,
Lange J.
Publication year - 2001
Publication title -
packaging technology and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.365
H-Index - 50
eISSN - 1099-1522
pISSN - 0894-3214
DOI - 10.1002/pts.540
Subject(s) - bending stiffness , stiffness , materials science , bending , composite material , adhesive , cantilever , layer (electronics) , modulus , structural engineering , engineering
Three different techniques for experimentally determining the bending stiffness of flexible films and laminates have been evaluated using a number of different packaging materials. The results showed that a cantilever test was the best, giving reliable data for all kinds of films and laminates. A three‐point bending test proved to be sensitive to misalignment, whereas a bending‐under‐own‐weight test was incapable of handling curled samples and generally gave lower stiffness values. A model for predicting the bending stiffness of multilayer laminates from the elastic modulus of the constituents was developed and used to examine the influence of layer position and composition on the overall bending stiffness. Model calculations showed that thin layers, such as adhesives, print and barrier coatings, can have a large influence on the bending stiffness and that the influence often goes against what would be intuitively expected. The calculations also showed that layer modulus often is less important than layer thickness and that the position of the layer in the laminate can have a major influence on the overall stiffness. Copyright © 2001 John Wiley & Sons, Ltd.