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Method for deriving the correlation between free fall and shock machine drop height
Author(s) -
Li Fanfu,
Twede Diana,
Goff James W.
Publication year - 1993
Publication title -
packaging technology and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.365
H-Index - 50
eISSN - 1099-1522
pISSN - 0894-3214
DOI - 10.1002/pts.2770060306
Subject(s) - drop (telecommunication) , shock (circulatory) , analyser , waveform , drop test , mechanics , shock response spectrum , mechanical engineering , physics , engineering , structural engineering , acceleration , classical mechanics , optics , electrical engineering , medicine , voltage
The purpose of this research was to investigate the correlation between shock machine drop height and free‐fall drop height based on equivalent transmitted shock velocity change. The transmitted shock velocity change of shock machine impacts (using plastic 2 ms half‐sine programmers) was measured with a waveform analyser, which is a part of the shock machine system. The transmitted shock velocity change of free‐fall drops was measured using the same waveform analyser in conjunction with a trigger device developed specifically for this study. The data were then analysed and a correlation between free‐fall drop height and shock machine drop height was derived, for a specific product/package system. For the shock machine and product/package used, the shock machine drop height was found to be equal to 1.31 + (0.74 × shock machine height). This equation will vary due to the dynamics of different product/package systems, different drop surfaces and the type of shock machine used.