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Assuring successful bonding to carton boards
Author(s) -
Shires D. A.
Publication year - 1988
Publication title -
packaging technology and science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.365
H-Index - 50
eISSN - 1099-1522
pISSN - 0894-3214
DOI - 10.1002/pts.2770010204
Subject(s) - carton , adhesive , bond , adhesive bonding , materials science , composite material , engineering drawing , manufacturing engineering , mechanical engineering , engineering , business , layer (electronics) , finance
This paper considers the factors that will influence successful adhesive bonding to carton‐boards. Although the paper assumes the use of carton‐board within the packaging industry, the majority of the arguments may be applied to other bonding applications. The commonest adhesive types used within the packaging industry for carton‐boards are PVA‐type emulsion and hot‐melts. Other adhesives used will include animal glues, starches and dextrines, acrylics etc. Although these adhesives vary considerably in properties they share the majority of requirements for successful bonding. The paper firstly considers bond structure and the basic modes of bond failure. It is surprising how often these are misunderstood or ignored when bonding problems occur. An inspection of the precise nature of a bond failure often suggests the cause of the problem, and at least eliminates a number of possible causes. The paper then discusses the properties required of boards, board surfaces (be they printed, varnished, coated or otherwise) and adhesives for the successful manufacture of bonds. Techniques for evaluating trial bond performance and, finally, the need for good 'housekeeping' are considered.