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Evaluation of the Wound Healing Properties of Hancornia speciosa Leaves
Author(s) -
Geller Fabiana Cristina,
Teixeira Marina Rodrigues,
Pereira Ana Bárbara Dias,
Dourado Luana Pereira Antunes,
Souza Danielle G.,
Braga Fernão Castro,
Simões Cláudia Maria Oliveira
Publication year - 2015
Publication title -
phytotherapy research
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.019
H-Index - 129
eISSN - 1099-1573
pISSN - 0951-418X
DOI - 10.1002/ptr.5438
Subject(s) - quinic acid , traditional medicine , rutin , mangifera , in vitro , tumor necrosis factor alpha , cytokine , wound healing , pharmacognosy , chemistry , pharmacology , biology , medicine , botany , biological activity , biochemistry , antioxidant , immunology
The leaves of Hancornia speciosa Gomes (Apocynaceae), a medicinal species found in the Brazilian cerrado biome, are traditionally used to treat wounds and inflammatory disorders. The goal of the present study was to investigate the in vitro wound healing properties of ethanolic extract of H. speciosa leaves and its isolated compounds, using the scratch assay, and to evaluate their effects on the release of the pro‐inflammatory cytokine tumor necrosis factor (TNF‐α) by lipopolysaccharide (LPS)‐stimulated human acute monocytic (THP‐1) cells. H. speciosa ethanolic extract significantly increased (42.8% ± 5.4 at 25 µg/mL) cell migration and proliferation of fibroblasts compared with control cells, as well as the isolated compounds bornesitol (80.8% ± 5.1) and quinic acid (69.1% ± 6.2), both assayed at 50 μM. TNF‐α release by LPS‐stimulated THP‐1 cells was significantly reduced by the ethanolic extract (62.9% ± 8.2, i.e. 1791.1 ± 394.7 pg/mL) at 10 µg/mL, bornesitol (48.9% ± 0.9, i.e. 2461.6 ± 43.1 pg/mL) at 50 μM, and quinic acid (90.2% ± 3.4, i.e. 473.5 ± 164.4 pg/mL) and rutin (82.4% ± 5.6, i.e. 847.0 ± 271.8 pg/mL) at 10 μM. These results provided evidences to support the traditional use of H. speciosa leaves to treat wounds and inflammatory disorders. Copyright © 2015 John Wiley & Sons, Ltd.