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Innovative Nanocomposites for Low Power Phase‐Change Memory: GeTe/C Multilayers
Author(s) -
Térébénec Damien,
Bernier Nicolas,
Castellani Niccolo,
Bernard Mathieu,
Jager Jean-Baptiste,
Tomelleri Martina,
Paterson Jessy,
Cyrille Marie-Claire,
Tran Nguyet-Phuong,
Giordano Valentina M.,
Hippert Françoise,
Noé Pierre
Publication year - 2022
Publication title -
physica status solidi (rrl) – rapid research letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.786
H-Index - 68
eISSN - 1862-6270
pISSN - 1862-6254
DOI - 10.1002/pssr.202200054
Subject(s) - materials science , annealing (glass) , phase change memory , optoelectronics , transmission electron microscopy , nanocomposite , sputtering , analytical chemistry (journal) , nanotechnology , thin film , composite material , chemistry , layer (electronics) , chromatography
Innovative nanocomposites consisting of [(GeTe) 4 nm/ C 1 nm ] 10 multilayers (MLs) deposited by magnetron sputtering are integrated in phase‐change memory (PCM) test devices with a “wall structure.” Scanning transmission electron microscopy (STEM) shows that an ML structure, with crystallized GeTe layers, is kept after integration in as‐fabricated devices and also after an additional annealing of the devices at 425 °C. The programming current (RESET current) required to reach the high resistance state of [(GeTe) 4 nm /C 1 nm ] 10 ML devices decreases by 45% after annealing at 425 °C. The reduction in RESET current is 55% and the reduction in drift coefficient is about 40% in ML devices annealed at 425 °C compared to similar devices incorporating Ge 2 Sb 2 Te 5 . STEM imaging, coupled with nano‐beam electron diffraction and electron energy loss spectroscopy, of ML devices in the high resistance state shows that the RESET current reduction after annealing is correlated to a reduction of the amorphized volume.