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All‐Solution‐Processed Micro/Nanowires with Electroplate Welding as Transparent Conducting Electrodes
Author(s) -
Yang Chaobin,
Merlo Juan M.,
D'Imperio Luke A.,
Rose Aaron H.,
Calm Yitzi M.,
Han Bing,
Gao Jinwei,
Zhou Guofu,
Burns Michael J.,
Kempa Krzysztof,
Naughton Michael J.
Publication year - 2019
Publication title -
physica status solidi (rrl) – rapid research letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.786
H-Index - 68
eISSN - 1862-6270
pISSN - 1862-6254
DOI - 10.1002/pssr.201970027
Subject(s) - nanowire , electroplating , materials science , photolithography , sheet resistance , electrode , scanning electron microscope , welding , electrical conductor , transmittance , optoelectronics , nanotechnology , composite material , layer (electronics) , chemistry
In article no. 1900010 , Chaobin Yang, Michael J. Naughton and co‐workers demonstrate two variants of an all‐solution method to produce silver micro/nanowire films as transparent conductors. By integrating crackle photolithography‐based microwires with nanowires and electroplate welding, the authors obtain transparent conductors with low sheet resistance (<1 ohm/sq.), high optical transmittance (>80%) and small domain size (∼10 μm2). It is shown that the samples can be transferred to flexible substrates, making a possible cost‐effective candidate for flexible applications. The cover picture shows a photograph of an all‐solution‐processed micro/nanowire transparent conducting electrode on 100 mmdiameter glass, held in front of a building. Bottom left: Scanning electron microscopy (SEM) image of the silver micro/ nanowires, bottom right: SEM of a junction between two nanowires after electroplating.