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All‐Solution‐Processed Micro/Nanowires with Electroplate Welding as Transparent Conducting Electrodes
Author(s) -
Yang Chaobin,
Merlo Juan M.,
D'Imperio Luke A.,
Rose Aaron H.,
Calm Yitzi M.,
Han Bing,
Gao Jinwei,
Zhou Guofu,
Burns Michael J.,
Kempa Krzysztof,
Naughton Michael J.
Publication year - 2019
Publication title -
physica status solidi (rrl) – rapid research letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.786
H-Index - 68
eISSN - 1862-6270
pISSN - 1862-6254
DOI - 10.1002/pssr.201900010
Subject(s) - materials science , sheet resistance , electroplating , nanowire , electrode , conductor , transmittance , optoelectronics , indium , electrical conductor , transparent conducting film , indium tin oxide , lithography , composite material , nanotechnology , layer (electronics) , chemistry
An all‐solution‐processed transparent conductive electrode with sheet resistance one order of magnitude smaller than conventional nanowire‐based transparent conductors has been developed. This is achieved by integrating all‐solution produced microwires with a nanowire solution and electroplating and electrowelding. Advantages of the resulting transparent conductor are indium‐free, vacuum‐free, and lithographic‐facility‐free, and metallic‐mask‐free, with small domain size (≈10 μm 2 ), low sheet resistance ( R s < 1 Ω □ −1 ), high optical transmittance ( T > 80%), mechanical flexibility, and scalability, thus making it an excellent replacement for ITO.