Microstructure, dielectric, and piezoelectric properties of 0.38Bi(Ga  x   Sc 1– x   )O 3 –0.62PbTiO 3  high temperature piezoelectric ceramics | Zendy

Jiang Yihang | Zendy; Qin Baoquan | Zendy; Zhao Yi | Zendy; Jiang Yuzhi | Zendy; Xiao Dingquan | Zendy; Zhu Jianguo | Zendy

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Microstructure, dielectric, and piezoelectric properties of 0.38Bi(Ga x Sc 1– x )O 3 –0.62PbTiO 3 high temperature piezoelectric ceramics

Author(s) -

Jiang Yihang,

Qin Baoquan,

Zhao Yi,

Jiang Yuzhi,

Xiao Dingquan,

Zhu Jianguo

Publication year - 2008

Publication title -

physica status solidi (rrl) – rapid research letters

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.786

H-Index - 68

eISSN - 1862-6270

pISSN - 1862-6254

DOI - 10.1002/pssr.200701254

Subject(s) - curie temperature , materials science , tetragonal crystal system , piezoelectricity , dielectric , ferroelectricity , microstructure , phase transition , analytical chemistry (journal) , crystal structure , crystallography , atmospheric temperature range , condensed matter physics , mineralogy , ferromagnetism , chemistry , physics , composite material , thermodynamics , optoelectronics , chromatography

0.38Bi(Ga x Sc 1– x )O 3 –0.62PbTiO 3 (BGSPT x ) ceramics have been prepared by using the conventional mixed oxide method. X‐ray diffraction analysis revealed that BGSPT x has a pure perovskite structure, and the crystal symmetry of BGSPT x changed from rhombohedral to tetragonal with increasing Ga content ( x ). The Curie temperature ( T C ) of BGSPT x ceramics is in the range of 448–467 °C for different x . The ferroelectric phase transition of BGSPT x was found to be of the first order type according to the Curie–Weiss law. For x = 0.125, BGSPT x ceramics show enhanced piezoelectric properties: piezoelectric constant d 33 = 420 pC/N and d 31 = –142 pC/N, planar and thickness electromechanical coupling factors k p = 56.27% and k t = 56.00%, respectively. The high‐ T C of BGSPT x coupled with its excellent piezoelectric properties suggests those future high‐temperature applications. (© 2008 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)

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