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Current collapse and reliability of III‐N heterostructure field effect transistors
Author(s) -
Koudymov A.,
Shur M. S.,
Simin G.,
Gaska R.
Publication year - 2007
Publication title -
physica status solidi (rrl) – rapid research letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.786
H-Index - 68
eISSN - 1862-6270
pISSN - 1862-6254
DOI - 10.1002/pssr.200701047
Subject(s) - degradation (telecommunications) , reliability (semiconductor) , materials science , heterojunction , current (fluid) , transistor , optoelectronics , trap (plumbing) , engineering physics , nuclear engineering , environmental science , electrical engineering , thermodynamics , physics , engineering , power (physics) , voltage , environmental engineering
Measurements of GaN HFET lifetime as a function of temperature show that different degradation mechanisms are involved at low temperatures (close to room temperature) and high temperatures (above 150 °C). The degradation at low temperatures is linked to the trap generation and can be explained using the current collapse model. At higher tempe‐ ratures, other degradation mechanisms become important or even dominant. The current collapse related degradation can be diminished by using improved device design, which will greatly increase the overall lifetime (up to long lifetimes obtained by extrapolating high temperature data to room temperature). (© 2007 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)