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Diffusion of vacancies under the order‐disorder transition temperature in CuAu
Author(s) -
Hashimoto I.,
Yamagata K.,
Oketani Y.,
Yamaguchi H.
Publication year - 1996
Publication title -
physica status solidi (b)
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.51
H-Index - 109
eISSN - 1521-3951
pISSN - 0370-1972
DOI - 10.1002/pssb.2221950106
Subject(s) - materials science , annealing (glass) , thermal diffusivity , condensed matter physics , transmission electron microscopy , atmospheric temperature range , diffusion , shrinkage , thermodynamics , composite material , nanotechnology , physics
The diffusion coefficient of vacancies in CuAu has been measured from the shrinkage rate of voids during annealing. The observations of voids have been carried out by transmission electron microscopy under the order‐disorder transition temperature in the temperature range between 453 and 653 K. The suppression of the diffusion of vacancies emitted from voids is seen at temperatures above 493 K. The reason is discussed briefly in comparison with the results for Cu 3 Au in terms of the diffusivity of vacancies around the voids.