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Work‐Hardening and Surface Investigations on Copper Single Crystals Oriented for Multiple Glide
Author(s) -
Vorbrugg W.,
Goetting H. Ch.,
Schwink Ch.
Publication year - 1971
Publication title -
physica status solidi (b)
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.51
H-Index - 109
eISSN - 1521-3951
pISSN - 0370-1972
DOI - 10.1002/pssb.2220460123
Subject(s) - materials science , copper , work hardening , hardening (computing) , crystallography , slip (aerodynamics) , single crystal , geometry , composite material , metallurgy , thermodynamics , chemistry , physics , mathematics , microstructure , layer (electronics)
For copper single crystals with axis orientations [110], [111], and [100] work‐hardening curves and surface phenomena were studied at various temperatures. Analogous to single glide crystals we succeeded in dividing the curves into different stages and correlating them with characteristic slip line patterns. [110] crystals show the same work‐hardening behaviour as single glide crystals, contrary to [111] and [100] ones where multiple glide is fundamental. The result of a quantitative analysis of the slip line photographs is that apparently for all orientations the same work‐hardening mechanisms are operating. However, in [111] and [100] crystals cross‐slip seems to occur in a way different from that in single glide crystals.