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Strain‐Driven Self‐Assembling of Nano‐Voids and Formation of Core–Shell Bubbles in SiSn/Si Layers
Author(s) -
Gaiduk Peter
Publication year - 2018
Publication title -
physica status solidi (b)
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.51
H-Index - 109
eISSN - 1521-3951
pISSN - 0370-1972
DOI - 10.1002/pssb.201700635
Subject(s) - materials science , transmission electron microscopy , void (composites) , vacancy defect , core (optical fiber) , dissolution , diffusion , precipitation , crystallographic defect , crystallography , shell (structure) , composite material , nanotechnology , chemical engineering , chemistry , thermodynamics , physics , meteorology , engineering
Self‐assembling of nanometer size voids in strained Sn precipitates after hot He + ion implantation is investigated by transmission electron microscopy (TEM). It is deduced from TEM study that high‐temperature irradiation produces vacancies which is collected by compressively strained Sn precipitates enhancing out‐diffusion of Sn atoms from the precipitates. The effects of implantation dose and Sn precipitate size on void formation and Sn out‐diffusion are documented and evolution of voids into core–shell Sn‐bubbles is reported. In particular, the size of the voids increased with the implantation dose and the voids are transformed to the core–shell Sn particles after implantation of 6 × 10 15 He + cm −2 . Formation of the core–shell structures is faster for Sn particles of smaller initial size. Strain‐enhanced separation of point defects along with vacancy‐assisted Sn out‐diffusion and precipitate dissolution are discussed.