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Encapsulating graphene by ultra‐thin alumina for reducing process contaminations
Author(s) -
Dauber Jan,
Terrés Bernat,
Trellenkamp Stefan,
Stampfer Christoph
Publication year - 2012
Publication title -
physica status solidi (b)
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.51
H-Index - 109
eISSN - 1521-3951
pISSN - 0370-1972
DOI - 10.1002/pssb.201200417
Subject(s) - graphene , materials science , raman spectroscopy , fabrication , layer (electronics) , nanotechnology , graphene foam , graphene oxide paper , yield (engineering) , optoelectronics , composite material , optics , medicine , physics , alternative medicine , pathology
Abstract We discuss a fabrication process for making graphene devices based on encapsulated graphene for reducing contaminations during individual processing steps. A 3–5 nm alumina layer is deposited directly after exfoliating graphene, protecting it during the entire processing. We show that the visibility of the encapsulated graphene is sufficient to identify graphene flakes and Raman spectra exhibit the characteristic finger print. We perform transport measurements to study the sample quality and compare the results with graphene samples processed without an alumina layer. In particular we observe a higher yield and significantly reduced contact resistances for devices fabricated with the here presented method.Graphene flake with metal (Cr/Au) contacts covered with an ultra‐thin (3–5 nm) oxidized aluminum layer (left) and without the layer (right).