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Numerical and analytical modelling of multi‐layer adhesive–film interface systems
Author(s) -
Chirima Gleny T.,
Zied Khaled M.,
Ravirala Naveen,
Alderson Kim L.,
Alderson Andrew
Publication year - 2009
Publication title -
physica status solidi (b)
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.51
H-Index - 109
eISSN - 1521-3951
pISSN - 0370-1972
DOI - 10.1002/pssb.200982038
Subject(s) - adhesive , materials science , composite material , modulus , shear modulus , finite element method , young's modulus , auxetics , moduli , elastic modulus , layer (electronics) , shear (geology) , structural engineering , physics , quantum mechanics , engineering
This paper reports the use of finite element modelling (FEM) simulations of the through‐thickness Young's and shear moduli of alternating film–adhesive multi‐layer interface materials. The FEM results were compared with analytical modified rule of mixtures (RM) predictions. Two representative adhesives (‘low’ and ‘high’ Young's moduli, with respect to the film Young's modulus) were used in combination with both conventional and auxetic films. Enhancements in the Young's modulus and shear modulus of the interface were predicted for the low modulus adhesive systems for both conventional and auxetic films. The auxetic film–low modulus adhesive systems showed enhancements by at least a factor of 2 in the through‐thickness mechanical properties compared to the conventional film–low modulus adhesive systems. Of the high modulus adhesive systems, only the auxetic film system showed enhancements in through‐thickness mechanical properties. The conventional film–high modulus adhesive systems showed a decrease in the through‐thickness Young's and shear moduli.