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Carbon nanotubes for interconnects in VLSI integrated circuits
Author(s) -
Robertson J.,
Zhong G.,
Telg H.,
Thomsen C.,
Warner J. M.,
Briggs G. A. D.,
Detlaff U.,
Roth S.,
Dijon J.
Publication year - 2008
Publication title -
physica status solidi (b)
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.51
H-Index - 109
eISSN - 1521-3951
pISSN - 0370-1972
DOI - 10.1002/pssb.200879553
Subject(s) - very large scale integration , carbon nanotube , nanotechnology , integrated circuit , materials science , chemical vapor deposition , raman spectroscopy , electronic circuit , transmission electron microscopy , computer science , optoelectronics , electrical engineering , engineering , embedded system , physics , optics
The paper reviews the requirements for carbon nanotubes to be used as interconnects in VLSI integrated circuits. It describes the production by chemical vapour deposition of high density arrays of nanotubes suitable for use as interconnects, and describes their characterisation by Raman and transmission electron microscopy. (© 2008 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)