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Grain boundary‐modified dielectric spectra of electroceramics: the occurrence of ‘unexpected' thermal dielectric loss peaks
Author(s) -
Antonelli Eduardo,
M'Peko JeanClaude,
Hernandes Antonio Carlos
Publication year - 2007
Publication title -
physica status solidi (b)
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.51
H-Index - 109
eISSN - 1521-3951
pISSN - 0370-1972
DOI - 10.1002/pssb.200642412
Subject(s) - grain boundary , dielectric , materials science , electroceramics , condensed matter physics , crystallite , dielectric loss , capacitor , phase boundary , ceramic , phase transition , phase (matter) , thermal , electrical impedance , work (physics) , crystal (programming language) , boundary (topology) , thermodynamics , composite material , chemistry , microstructure , physics , optoelectronics , voltage , metallurgy , mathematics , alternative medicine , mathematical analysis , pathology , microfabrication , computer science , quantum mechanics , fabrication , programming language , medicine , organic chemistry
Manifestation of dielectric/magnetic anomalies is often used to postulate or corroborate occurrence of structural phase transitions in both single‐crystal and polycrystalline materials. In the latter case, furthermore, some important aspects of grain‐boundary influence on the overall electrical response of materials have been more or less extensively characterized elsewhere. Nevertheless, the possible occurrence of ‘anomalous' thermal dielectric loss peaks, not associated with phase transitions or any other potential source, but still arising from grain boundary‐induced effects, has been less considered and explored. Here, BaZrO 3 ceramics, commonly proposed to be attractive in the capacitor industry, are found to qualitatively and quantitatively help discussing and approaching this question by measuring, deeply treating and analyzing fixed‐frequency and frequency‐dependent impedance data. The overall work shows that grain boundary‐induced thermal dielectric peaks may occur, with temperature locations that may also be reasonably predicted. © 2007 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim