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A comparative study of helium atom diffusion via an interstitial mechanism in nickel and palladium
Author(s) -
Xia Jixing,
Hu Wangyu,
Yang Jianyu,
Ao Bingyun,
Wang Xiaolin
Publication year - 2006
Publication title -
physica status solidi (b)
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.51
H-Index - 109
eISSN - 1521-3951
pISSN - 0370-1972
DOI - 10.1002/pssb.200541458
Subject(s) - helium , activation energy , nickel , palladium , arrhenius equation , diffusion , helium atom , chemistry , atom (system on chip) , thermodynamics , atomic physics , catalysis , physics , organic chemistry , computer science , embedded system
At low temperatures, helium atoms diffuse primarily by an interstitial mechanism due to the lower activation energy. Using a modified analytic embedded‐atom model (MAEAM) and the molecular dynamics method, a study of the interstitial diffusion for helium atoms in perfect nickel and palladium was performed. Consequently, the diffusion coefficient was calculated from the jump‐frequency method. The temperature dependency of the diffusion coefficient was found to agree well with the Arrhenius relation. The activation energies of the interstitial mechanism in these two metals were obtained by fitting to the Arrhenius relation, and the results agree with the available experimental and other theoretical data. In addition, by comparing the diffusion activation energies of helium atoms in nickel and palladium, it is found that the helium atom is less mobile in palladium than in nickel. (© 2006 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)

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