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The Active Slip Volume and the Temperature‐Dependent Processes in Stage I of Single Crystals of Cu Alloys
Author(s) -
Schwink Ch.,
Traub H.
Publication year - 1968
Publication title -
physica status solidi (b)
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.51
H-Index - 109
eISSN - 1521-3951
pISSN - 0370-1972
DOI - 10.1002/pssb.19680300146
Subject(s) - materials science , slip (aerodynamics) , activation energy , lüders band , volume (thermodynamics) , flow stress , strain rate , copper , crystallography , thermodynamics , condensed matter physics , metallurgy , chemistry , microstructure , physics
Investigations of the easy glide region in single crystals of well‐known f.c.c. Cu alloys between 85 and 400°K are reported. From careful measurements of the strain rate dependence of the flow stress and from microscopic observations (static and cinematographic) of the development of the glide bands it is concluded that the “active slip volume” [1] of these crystals depends on strain rate and temperature. A detailed analysis of the results yields values for the number, the activation energy, and the activation volume of the obstacles responsible for the thermally activated process. We suggest that the obstacles are statistically distributed clusters of the atoms alloyed to copper.