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The Temperature Dependence of the Flow Stress of Copper Single Crystals
Author(s) -
Bullen F. P.,
McK. Cousland S.
Publication year - 1968
Publication title -
physica status solidi (b)
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.51
H-Index - 109
eISSN - 1521-3951
pISSN - 0370-1972
DOI - 10.1002/pssb.19680270205
Subject(s) - single crystal , copper , materials science , flow stress , crystallite , deformation (meteorology) , hardening (computing) , flow (mathematics) , plasticity , crystallography , condensed matter physics , thermodynamics , composite material , metallurgy , strain rate , mechanics , chemistry , physics , layer (electronics)
It is shown that the Cottrell‐Stokes ratios of copper single crystals are not constant during tensile deformation in stages II and III at temperatures from 77 to 443°K. However, there appears to be a fixed relationship between the Cottrell‐Stokes ratio and the flow stress (as measured at a standard temperature). This relationship is independent of crystal orientation and the temperature or stage of deformation. The relationship is similar to that previously reported for polycrystalline copper [1], although not quantitatively identical. These relationships have been interpreted as evidence that the obstacles responsible for temperature‐dependent hardening are formed by the action of stresses from arrays of primary dislocations. The nature of the unloading yield point and its relevance to the reversible change in flow stress are also discussed.