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Investigation of grain boundary energetics in Er 2 O 3 thin foils by transmission electron microscopy
Author(s) -
Murr L. E.
Publication year - 1968
Publication title -
physica status solidi (b)
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.51
H-Index - 109
eISSN - 1521-3951
pISSN - 0370-1972
DOI - 10.1002/pssb.19680250216
Subject(s) - grain boundary , dihedral angle , materials science , transmission electron microscopy , ceramic , grain boundary diffusion coefficient , thin film , crystallography , triple junction , oxide , condensed matter physics , geometry , composite material , chemistry , microstructure , nanotechnology , metallurgy , physics , mathematics , optoelectronics , hydrogen bond , organic chemistry , molecule
The oxidation of erbium thin films directly within the electron microscope, and the subsequent grain growth and equilibration of the Er 2 O 3 foils have allowed the true dihedral angles at grain boundary triple junctions to be calculated. It is observed that a mean dihedral angle of 120° obtains for these oxide‐ceramic films; and the comparison of the three‐dimensionally computed dihedral angles with the two‐dimensional angles measured directly from electron microscope images of grain boundary triple junctions in Er 2 O 3 exhibited a uniqueness which questions the necessity of three‐dimensional corrections for this particular property. The distribution of relative grain boundary free energy ratios in Er 2 O 3 foils is also calculated; and the spread of this data is interpreted to represent the effects of the relative grain orientations composing a triple junction. The mean boundary inclination is observed to be 71.1°, which suggests an influence on grain boundary equilibration in thin foils of surface image forces. The results generally indicate that the application of techniques previously utilized in the study of metallic grain boundary energetics is equally valid in certain oxide‐ceramic thin films.