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Surface self‐diffusion measurements on copper
Author(s) -
Bonzel H. P.,
Gjostein N. A.
Publication year - 1968
Publication title -
physica status solidi (b)
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.51
H-Index - 109
eISSN - 1521-3951
pISSN - 0370-1972
DOI - 10.1002/pssb.19680250120
Subject(s) - copper , annealing (glass) , activation energy , surface diffusion , discontinuity (linguistics) , diffusion , impurity , thermodynamics , atmospheric temperature range , self diffusion , hydrogen , chemistry , materials science , analytical chemistry (journal) , adsorption , metallurgy , physics , chromatography , organic chemistry , mathematical analysis , mathematics , self service , marketing , business
The decay kinetics of sinusoidal surface profiles on copper annealed in a hydrogen atmosphere were investigated in the temperature range 600 to 1030 °C in order to determine the temperature dependence of the surface self‐diffusion coefficient, D s . Below 910 °C the surface profiles were found to be faceted resulting in an apparent discontinuity in D s which can be understood in terms of the γ‐plot of copper. The discontinuity in the diffusion data can be expressed by the following equations:At temperatures below 800 °C is dependent on the annealing time, and inthe vicinity of 600 °C, D s drops drastically below the minimumvalue that can be measured. This behavior can be explained in terms of the rate theory for a bimolecular surface reation between impurities and diffusing defects. From the predicted time dependence of D s , it is possible to estimate D s at t=0. These D s −values are greater than the extrapolated high temperature data, thus indicating thepossibility of a lower activation energy for surface self‐diffusion at low temperatures.