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Measurement of Thermal Parameters of Thin Films and Plane‐Parallel Plates Located on a Thermally Conductive Base
Author(s) -
Budke O.,
Krempaský J.
Publication year - 1967
Publication title -
physica status solidi (b)
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.51
H-Index - 109
eISSN - 1521-3951
pISSN - 0370-1972
DOI - 10.1002/pssb.19670210115
Subject(s) - thermal diffusivity , thermal conductivity , materials science , thermal conductivity measurement , electrical conductor , base (topology) , thermal , computation , thermal conduction , point (geometry) , heat equation , composite material , mechanics , thermodynamics , geometry , mathematical analysis , physics , mathematics , algorithm
A method is developed for measuring the thermal conductivity, thermal diffusivity, and specific heat of thin films and plates located on a thermally conductive base. The method of measurement involves the use of a point or line pulse heat source. Mathematical expressions for the present treatment are derived from the computed solution of the complex transcendental equations. The present method makes it possible to measure the temperature characteristics of samples of thickness h ≧ 10 μm located on a base with a practically arbitrary thermal conductivity and a definite temperature characteristic. However, the computation can easily be extended to include samples of thickness h < 10 μm.