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Grain Boundary Sliding in Bicrystals of Tin
Author(s) -
Tuck Brian
Publication year - 1965
Publication title -
physica status solidi (b)
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.51
H-Index - 109
eISSN - 1521-3951
pISSN - 0370-1972
DOI - 10.1002/pssb.19650080116
Subject(s) - grain boundary sliding , tin , materials science , grain boundary , electropolishing , metallurgy , composite material , chemistry , microstructure , electrode , electrolyte
Bicrystals of tin were tested in shear over a range of stresses and temperatures near the melting‐point. Boundary sliding occurred initially at a constant rate, followed by a period of steadily decreasing rate until movement almost ceased; the initial rate data fell into two clearly defined groups. In a few specimens, sudden increases in sliding rate were observed. Values were calculated for the activation energy and the stress dependence of the initial rate of sliding. During a test, the boundary trace on one of the bicrystal surfaces became very irregular. A straight trace could be regained by electropolishing the surface and an increased rate of sliding was obtained if the specimen was retested.