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Thermal and Damp Heat Stability of High‐Mobility In 2 O 3 ‐Based Transparent Conducting Films Fabricated at Low Process Temperatures
Author(s) -
Koida Takashi,
Ueno Yuko
Publication year - 2021
Publication title -
physica status solidi (a)
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.532
H-Index - 104
eISSN - 1862-6319
pISSN - 1862-6300
DOI - 10.1002/pssa.202170017
Subject(s) - materials science , plasma , crystallite , evaporation , thermal stability , electrical conductor , oxide , deposition (geology) , ion plating , analytical chemistry (journal) , chemical engineering , optoelectronics , thin film , composite material , metallurgy , nanotechnology , chemistry , thermodynamics , sediment , biology , engineering , paleontology , physics , chromatography , quantum mechanics
Transparent Conductive Oxide Polycrystalline In 2 O 3 :Me (Me: W, Ce) and solid‐phase crystallized In 2 O 3 :Me,H films with high electron mobility can be fabricated at low process temperatures of ≈200 °C by ion plating with DC arc discharge, known as high‐density plasma enhanced evaporation or reactive plasma deposition (RPD). More details can be found in article number 2000487 by Takashi Koida and Yuko Ueno.