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Tailoring the Surface Characteristics of CuSe Thin Films by Adjusting the Compositional Ratio
Author(s) -
Lee Jihyeon,
Kim Donghyun,
Park Juyun,
Oh JinWoo,
Kang YongCheol
Publication year - 2021
Publication title -
physica status solidi (a)
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.532
H-Index - 104
eISSN - 1862-6319
pISSN - 1862-6300
DOI - 10.1002/pssa.202100148
Subject(s) - x ray photoelectron spectroscopy , selenide , materials science , copper , analytical chemistry (journal) , contact angle , electrical resistivity and conductivity , morphology (biology) , thin film , grain size , conductivity , chemical engineering , selenium , nanotechnology , composite material , metallurgy , chemistry , electrical engineering , chromatography , biology , engineering , genetics
Using radio frequency (RF) magnetron cosputtering, copper selenide thin films (TFs) with various ratios of Se are fabricated herein. To observe how the chemical and physical properties change based on morphology, the ratio of metallic Cu to nonmetallic Se is tuned to form multiple different compositions. The compositional percentage of the surface is determined by X‐ray photoelectron spectroscopy (XPS). Noticeable transitions of the characteristics of TFs are affected by Cu to a higher degree than Se. Larger grain sizes are observed when the Se ratio is high in Cu‐rich TFs. Most copper selenide TFs are hydrophobic and portray these characteristics the strongest when the surface Se ratio of TF is 16.62% as the contact angle with distilled water is 129°. In addition, the electrical conductivity is the highest at 2.04 (±0.13) × 10 7  S m −1 when the surface Se ratio is 10.95%.

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