Premium
Heterogeneous Compound Semiconductor Integration
Author(s) -
Cok Ronald S.,
Gomez David
Publication year - 2021
Publication title -
physica status solidi (a)
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.532
H-Index - 104
eISSN - 1862-6319
pISSN - 1862-6300
DOI - 10.1002/pssa.202000394
Subject(s) - materials science , silicon , substrate (aquarium) , semiconductor , transfer printing , compound semiconductor , optoelectronics , elastomer , nanotechnology , ceramic , composite material , oceanography , geology , epitaxy , layer (electronics)
Micro‐transfer printing (μTP) provides fast and precise assembly of micro‐components from a variety of different source materials onto non‐native target substrates such as glass, plastic, ceramic, and silicon. Retrievable micro‐components are picked up by an elastomer stamp and printed onto the target substrate with yields exceeding 99.9%. Devices incorporating GaN, GaAs, InP, and other compound semiconductor materials are successfully integrated onto silicon and glass with fine precision to make highly integrated compound semiconductor micro‐systems.