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Informative Aspects of Molten KOH Etch Pits Formed at Basal Plane Dislocations on the Surface of 4H‐SiC
Author(s) -
Nishio Johji,
Ota Chiharu,
Okada Aoi,
Iijima Ryosuke
Publication year - 2020
Publication title -
physica status solidi (a)
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.532
H-Index - 104
eISSN - 1862-6319
pISSN - 1862-6300
DOI - 10.1002/pssa.202000332
Subject(s) - dislocation , partial dislocations , materials science , perpendicular , basal plane , crystallography , condensed matter physics , stacking , wafer , sublimation (psychology) , epitaxy , stacking fault , composite material , geometry , optoelectronics , chemistry , physics , psychology , mathematics , organic chemistry , layer (electronics) , psychotherapist
Despite being a destructive technique, molten KOH etch pits at basal plane dislocations are found to have informative aspects, as revealed by photoluminescence imaging and optical microscopy, on the 4° off‐cut (0001) surface of 4H‐SiC p–i–n diode chips, where single Shockley‐type stacking faults have expanded during electroluminescence experiments. Smaller etch pits are observed aligning on single lines along ±[ 1 ¯ 100] that are the shallowest sides of stacking faults. Through closer observation of the pits, the facing directions are found to agree well with a model explaining the two types of partial dislocations constituting the line. Other basal plane dislocation pits are observed by scanning electron microscopy on the sublimation‐grown wafer surface before epitaxial growth. The distances between the partial dislocation cores are measured at each pit. No basal plane dislocation etch pit facing toward ±[ 1 ¯ 100] is found, but a weak correlation is noted between the partial dislocation distance at the cores and the direction that the basal plane dislocations face. The corresponding results are discussed in terms of the image force and the force exerted on steps perpendicular to the (0001) plane, to understand the mechanisms of basal plane dislocation propagation and/or conversion to threading edge dislocations.