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Outstanding Photocurrent Density and Incident Photon‐to‐Current Conversion Efficiency of Liquid‐State NiO Perovskite‐Sensitized Solar Cells
Author(s) -
Alessa Hussain,
Noh Mohamad Firdaus Mohamad,
Mumthas Inzamam Nawas Nawas,
Wijayantha Kahagala Gamage Upul,
Teridi Mohd Asri Mat
Publication year - 2020
Publication title -
physica status solidi (a)
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.532
H-Index - 104
eISSN - 1862-6319
pISSN - 1862-6300
DOI - 10.1002/pssa.201900607
Subject(s) - non blocking i/o , photocurrent , materials science , energy conversion efficiency , perovskite (structure) , current density , chemical vapor deposition , nickel oxide , optoelectronics , triiodide , thin film , solar cell , electrode , chemical bath deposition , chemical engineering , nanotechnology , dye sensitized solar cell , oxide , chemistry , catalysis , electrolyte , metallurgy , physics , quantum mechanics , engineering , biochemistry
The efficiency and photocurrent density reported for p‐type‐sensitized solar cells up to now are still lagging behind that of the n‐type counterparts, limiting the successful development of p–n tandem cells. To circumvent this issue, NiO thin film is fabricated by the aerosol‐assisted chemical vapor deposition (AACVD) technique and used in p‐type solar cells. A systematic study is conducted to comprehend the correlation between NiO thickness and the power conversion efficiency (PCE) of liquid‐state NiO‐based sensitized solar cells. By carefully designing the cell components, this type of device demonstrates the highest photocurrent density ( J sc ) exceeding 18 mA cm −2 when using iodine/triiodide as the redox shuttle matching the one produced by the TiO 2 counterpart. This is accomplished by 1) using the AACVD technique for the one‐step deposition of compact and mesoporous NiO electrodes, 2) optimizing the thickness of the NiO layer through controlling the deposition time, and 3) adopting methylammonium lead iodide (CH 3 NH 3 PbI 3 ) as a light harvester prepared via a sequential deposition method.