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Evolution and Recovery of Electrical Property of Reactive Sputtered Al‐Doped ZnO Transparent Electrode Exposed to Harsh Environment
Author(s) -
Machda Fahmi,
Ogawa Takaya,
Okumura Hideyuki,
Ishihara Keiichi N.
Publication year - 2020
Publication title -
physica status solidi (a)
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.532
H-Index - 104
eISSN - 1862-6319
pISSN - 1862-6300
DOI - 10.1002/pssa.201900519
Subject(s) - annealing (glass) , materials science , thin film , doping , sputtering , electrode , conductivity , degradation (telecommunications) , electrical resistivity and conductivity , sputter deposition , humidity , chemical engineering , carrier lifetime , composite material , optoelectronics , nanotechnology , silicon , electronic engineering , chemistry , electrical engineering , physics , engineering , thermodynamics
Al‐doped ZnO (AZO) thin film is extensively studied as a promising alternative for Sn‐doped In 2 O 3 (ITO) transparent electrode from the viewpoint of safety, environment, and material costs. However, most of AZO thin films are reported to degrade when exposed to high humidity. To find a key factor of durability, the electrical properties of AZO thin films after harsh conditions are characterized in this study. AZO thin films are prepared on glass substrates by reactive radiofrequency magnetron sputtering, followed by annealing at 400–550 °C in a hydrogen atmosphere. For harsh environment, a damp heat test is performed at 85 °C and 85% relative humidity, where the changes in both the carrier concentration and mobility are examined. It is found that the carrier concentration exhibits similar decreasing tendencies to conductivity degradation as a function of annealing temperature. This means that higher temperature contributes to the stability of carrier concentration, i.e., conductivity. Re‐annealing is also conducted for the AZO samples after the damp heat test, and the original conductivity is successfully recovered. This indicates that the degradation mechanism involves the chemical aspect rather than physical damage such as cracks, which cannot be recovered by annealing.