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Enhancing the Retention Force of Press‐Fit Connections by Ultrasonic Excitation
Author(s) -
Halm Cynthia,
Otto Andreas,
Stark Tilman,
Schaaf Peter
Publication year - 2018
Publication title -
physica status solidi (a)
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.532
H-Index - 104
eISSN - 1862-6319
pISSN - 1862-6300
DOI - 10.1002/pssa.201700598
Subject(s) - ultrasonic sensor , excitation , amplitude , retention time , process (computing) , materials science , acoustics , composite material , electrical engineering , computer science , engineering , physics , optics , chemistry , operating system , chromatography
Press‐fit technology is a well‐known process in electrical joining and connecting. This process is combined with a subsequent ultrasonic excitation of the printed circuit board (PCB) to enhance the retention force. No additional temperature treatment is necessary because the holding force increases directly after the process. It is discussed how the amplitude and the duration of ultrasonic excitation determine the resulting retention force. A suitable set of parameters is found to increase the retention force. The materials details of the bonds are analyzed. Two models are created to explain the results. These models can be used to predict the retention force for further investigations with changed geometries or materials.