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Temperature‐dependent thermal conductivity of flexible yttria‐stabilized zirconia substrate via 3ω technique
Author(s) -
Singh Shivkant,
Yarali Milad,
Shervin Shahab,
Venkateswaran Venkat,
Olenick Kathy,
Olenick John A.,
Ryou JaeHyun,
Mavrokefalos Anastassios
Publication year - 2017
Publication title -
physica status solidi (a)
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.532
H-Index - 104
eISSN - 1862-6319
pISSN - 1862-6300
DOI - 10.1002/pssa.201700069
Subject(s) - thermal conductivity , materials science , yttria stabilized zirconia , fabrication , ceramic , flexible electronics , grain size , cubic zirconia , nanotechnology , substrate (aquarium) , electronics , composite material , optoelectronics , electrical engineering , medicine , oceanography , alternative medicine , engineering , pathology , geology
Thermal management in flexible electronic has proven to be challenging thereby limiting the development of flexible devices with high power densities. To truly enable the technological implementation of such devices, it is imperative to develop highly thermally conducting flexible substrates that are fully compatible with large‐scale fabrication. Here, we present the thermal conductivity of state‐of‐the‐art flexible yttria‐stabilized zirconia (YSZ) substrates measured using the 3ω technique, which is already commercially manufactured via roll‐to‐roll technique. We observe that increasing the grain size increases the thermal conductivity of the flexible 3 mol.% YSZ, while the flexibility and transparency of the sample are hardly affected by the grain size enlargement. We exhibit thermal conductivity values of up to 4.16 Wm −1 K −1 that is at least 4 times higher than state‐of‐the‐art polymeric flexible substrates. Phonon‐hopping model (PHM) for granular material was used to fit the measured thermal conductivity and accurately define the thermal transport mechanism. Our results show that through grain size optimization, YSZ flexible substrates can be realized as flexible substrates, that pave new avenues for future novel application in flexible electronics through the utilization of both their ceramic structural flexibility and high heat dissipating capability.