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The influence of deposition temperature on the adhesion of diamond films deposited on WC–Co substrates using a Cr–N interlayer
Author(s) -
Fischer Miriam,
Chandran Maneesh,
Akhvlediani Rozalia,
Hoffman Alon
Publication year - 2015
Publication title -
physica status solidi (a)
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.532
H-Index - 104
eISSN - 1862-6319
pISSN - 1862-6300
DOI - 10.1002/pssa.201532210
Subject(s) - diamond , materials science , chemical vapor deposition , composite material , material properties of diamond , deposition (geology) , adhesion , substrate (aquarium) , nanoindentation , raman spectroscopy , residual stress , carbon film , thin film , metallurgy , chemical engineering , nanotechnology , optics , paleontology , oceanography , physics , engineering , sediment , geology , biology
The possibility of combining the hardness of diamond with the toughness of WC–Co has attracted a great attention toward the deposition of diamond films on WC–Co substrates due to their potential industrial applications. However, the performance of diamond coated WC–Co machining tools is limited by the coating‐substrate adhesion strength. In this work, we report on the effect of deposition temperature on the adhesion of diamond films deposited on WC–10%Co substrates. Prior to diamond deposition, an interlayer of 1.5 μm thick Cr–N was deposited on the WC–Co substrates to minimize cobalt diffusion. Diamond films were deposited using hot filament chemical vapor deposition technique at different temperatures (500–750 °C). Phase purity and residual stress of diamond films were investigated by Raman spectroscopy. Adhesion was determined using Vickers hardness test with discrete loads of 20 kgf by examining the failure occurred at the weaker interface, which allows an easy propagation of indentation induced lateral cracks. The weaker interface was found at the diamond/Cr–N interlayer. Improved adhesion was found for diamond films deposited at 650 °C, compared to the films deposited at other temperatures. A comprehensive analysis about the optimum deposition temperature that leads to better adhesion is discussed.