Fabrication of ion‐sliced lithium niobate slabs using helium ion implantation and Cu–Sn bonding | Zendy

Xiang BingXi | Zendy; Guan Jing | Zendy; Jiao Yang | Zendy; Wang Lei | Zendy

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Fabrication of ion‐sliced lithium niobate slabs using helium ion implantation and Cu–Sn bonding

Author(s) -

Xiang BingXi,

Guan Jing,

Jiao Yang,

Wang Lei

Publication year - 2014

Publication title -

physica status solidi (a)

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.532

H-Index - 104

eISSN - 1862-6319

pISSN - 1862-6300

DOI - 10.1002/pssa.201431138

Subject(s) - lithium niobate , materials science , fabrication , annealing (glass) , ion , ion implantation , diffusion bonding , rutherford backscattering spectrometry , optoelectronics , thin film , nanotechnology , composite material , chemistry , medicine , alternative medicine , organic chemistry , pathology

The fabrication of LiNbO 3 waveguide slabs with sub‐micron thickness is presented using He ion‐induced splitting and the Cu–Sn bonding technique. The exfoliation time of implanted LiNbO 3 was investigated as a function of annealing temperatures to reveal the activation energies during the splitting process. Defect‐free waveguide films with large areas of several cm 2 are consistently produced by using the inter‐diffusion bonding of Cu–Sn interface. The fabricated film was investigated by using the Rutherford backscattering/channeling method and dark mode spectroscopy.

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