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Properties and characteristics of wet ( HF ) and dry ( RIE ) etched borosilicate glass
Author(s) -
Blass J.,
Köhler O.,
Fingerle M.,
Müller C.,
Ziegler C.
Publication year - 2013
Publication title -
physica status solidi (a)
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.532
H-Index - 104
eISSN - 1862-6319
pISSN - 1862-6300
DOI - 10.1002/pssa.201200769
Subject(s) - borosilicate glass , surface roughness , materials science , etching (microfabrication) , surface finish , dry etching , adsorption , composite material , isoelectric point , chemical engineering , chemistry , layer (electronics) , biochemistry , engineering , enzyme
Wet and dry etching methods were used to physically modify the surface of borosilicate glass for further measurements in roughness‐induced protein adsorption. The etching parameters determine the roughness of the glass surface while other parameters are not significantly changed. To exclude a chemical alteration of the surface, the isoelectric points, contact angles, and surface energies were analyzed before and after the etching process.