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Characterization of nanoscaled solder material
Author(s) -
Novikov Andrej,
Nowottnick Mathias
Publication year - 2012
Publication title -
physica status solidi (a)
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.532
H-Index - 104
eISSN - 1862-6319
pISSN - 1862-6300
DOI - 10.1002/pssa.201100541
Subject(s) - materials science , tin , sputtering , differential scanning calorimetry , silicon , scanning electron microscope , silicon nitride , layer (electronics) , coating , metallurgy , composite material , thin film , nanotechnology , physics , thermodynamics
The properties of nanoscaled layers of pure tin have been studied. The layers were produced by sputtering in different thicknesses between 10 and 100 nm. The surface topography and the influence of process parameters on the sputtering rate were characterized using scanning electron microscopy (SEM) and atomic force microscopy (AFM) methods. To avoid oxidation carbon and silicon nitride protective layers were sputtered in the same process chamber. The function of this coating was investigated by X‐ray diffraction (XRD). The crystallographic structure of tin layer under silicon nitride was measured directly after sputtering, melting and cooling processes. The crystalline tin film after cooling down and the absence of tin oxide peaks were used as indicators for impermeability of oxygen. For investigation of phase change the method of chip differential calorimetry (DSC) was used. The samples were prepared as standalone samples for reuse of DSC‐chips and also sputtered directly on the DSC chip for single use. The prepared samples with one tin layer and multilayer of tin scaled down to 10 nm were investigated with this method.