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Nanomanipulation of 2 inch wafer fabrication of vertically aligned carbon nanotube arrays by nanoimprint lithography
Author(s) -
Bu Ian Y. Y.,
Eichhorn Volkmar,
Carlson Kenneth,
Boggild Peter,
Fatikow Sergej
Publication year - 2011
Publication title -
physica status solidi (a)
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.532
H-Index - 104
eISSN - 1862-6319
pISSN - 1862-6300
DOI - 10.1002/pssa.201084178
Subject(s) - nanoimprint lithography , materials science , wafer , carbon nanotube , nanotechnology , fabrication , resist , etching (microfabrication) , lithography , reactive ion etching , electron beam lithography , plasma enhanced chemical vapor deposition , chemical vapor deposition , optoelectronics , layer (electronics) , medicine , alternative medicine , pathology
Carbon nanotube (CNT) arrays are typically defined by electron beam lithography (EBL), and hence limited to small areas due to the low throughput. To obtain wafer‐scale fabrication we propose large area thermal nanoimprint lithography (NIL). A 2‐inch stamp master is defined using EBL for subsequent pattern transfer to a hard metal mask before deep reactive ion etching (RIE) to form the stamp protrusions. This stamp master is then pressed against a wafer covered with nanoimprint resist, at a temperature above the glass transition temperature, transferring the pattern to polymer. Using this process, efficient production of wafer‐scale/larger arrays of CNTs has been achieved. The CNTs have been deposited by wafer‐scale plasma enhanced chemical vapour deposition (PECVD) of C 2 H 2 /NH 3 . Substrates containing such nanotubes have been used to automate nanorobotic manipulation sequences of individual CNTs and their assembly into prototypic CNT‐based devices.