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Sulfide anion interaction with Cu(1 0 0) and Cu modified Au(1 0 0): An electrochemical STM study
Author(s) -
Schlaup Christian,
Spaenig Alexander,
Broekmann Peter,
Wandelt Klaus
Publication year - 2010
Publication title -
physica status solidi (a)
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.532
H-Index - 104
eISSN - 1862-6319
pISSN - 1862-6300
DOI - 10.1002/pssa.200982489
Subject(s) - copper , monolayer , underpotential deposition , electrochemistry , copper sulfide , sulfide , electrolyte , inorganic chemistry , electrode , chemistry , phase (matter) , materials science , cyclic voltammetry , metallurgy , nanotechnology , organic chemistry
Abstract We describe the formation of thin copper sulfide semiconductor films under electrochemical conditions. In a first step we investigated the fundamental interaction of the Cu(1 0 0) surface with a sulfide anions containing electrolyte. Beside the classical p (2 × 2)‐S and c (2 × 6)‐S adlayer phases we found the formation of a closer packed “pseudo‐ c (2 × 2)”‐S phase accompanied by an expansion of the topmost copper layer. For a further investigation of this “pseudo‐ c (2 × 2)”‐S phase, we switched from the bulk Cu(1 0 0) electrode to a copper monolayer on a Au(1 0 0) electrode, which can be easily prepard using copper underpotential deposition. Since such a copper monolayer is pseudomorphic to the Au(1 0 0) surface and therefore expanded by 12.5% with respect to the bulk Cu(1 0 0)‐plane, exclusively a commensurate c (2 × 2)‐S structure is instantaneously formed and remains stable over a wide potential range.