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Characterization of electroplated, thick permalloy films
Author(s) -
Getlawi S.,
Theis M.,
Friedrich S.,
KoblischkaVeneva A.,
Koblischka M. R.,
Saumer M.,
Hartmann U.
Publication year - 2008
Publication title -
physica status solidi (a)
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.532
H-Index - 104
eISSN - 1862-6319
pISSN - 1862-6300
DOI - 10.1002/pssa.200723621
Subject(s) - permalloy , materials science , electron backscatter diffraction , foil method , transmission electron microscopy , substrate (aquarium) , wafer , electroplating , composite material , metallurgy , layer (electronics) , magnetization , optoelectronics , microstructure , nanotechnology , magnetic field , physics , oceanography , quantum mechanics , geology
Abstract Permalloy (Ni 81 Fe 19 ) films and foils were fabricated by means of electroplating. Two different types of samples were produced, (i) a patterned permalloy film on a Si wafer (type 1) and (ii) a NiFe foil (type 2), which was separated from the substrate after deposition. The samples were characterized employing magnetic force microscopy (MFM), transmission electron microscopy (TEM) and electron‐backscatter diffraction (EBSD). On the foil type sample, MFM reveals a maze domain pattern, and on the structured samples (type 1), a Landau domain pattern is obtained. EBSD enables the identification of the permalloy Kikuchi pattern without the effect of a substrate. The analysis reveals randomly oriented grains with a narrow size distribution. (© 2008 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)