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Electrochemical fabrication of buried folded microchannels into silicon substrates
Author(s) -
Barillaro G.,
Nannini A.,
Piotto M.
Publication year - 2007
Publication title -
physica status solidi (a)
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.532
H-Index - 104
eISSN - 1862-6319
pISSN - 1862-6300
DOI - 10.1002/pssa.200674386
Subject(s) - microchannel , fabrication , silicon , materials science , surface micromachining , substrate (aquarium) , etching (microfabrication) , nanotechnology , optoelectronics , layer (electronics) , geology , medicine , oceanography , alternative medicine , pathology
In this work an original process for buried folded silicon microchannel fabrication is reported. Electrochemical micromachining is exploited to etch high aspect ratio meander‐shaped trenches into a silicon substrate. Thermal oxidation is then employed to seal the top of etched trenches and obtain buried microchannels at the bottom. The process is straightforward and allows the integration of buried folded channels into silicon substrates with a high density. Experimental results are reported and advantages and drawbacks of the proposed process are discussed. (© 2007 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)