Microstructure of multi‐layered interphases processed by temperature‐pulsing chemical vapor infiltration | Zendy

Yuan M. | Zendy; Huang Zh. R. | Zendy; Dong Sh. M. | Zendy; Zhu Y. Zh. | Zendy; Jiang D. L. | Zendy

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Microstructure of multi‐layered interphases processed by temperature‐pulsing chemical vapor infiltration

Author(s) -

Yuan M.,

Huang Zh. R.,

Dong Sh. M.,

Zhu Y. Zh.,

Jiang D. L.

Publication year - 2006

Publication title -

physica status solidi (a)

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.532

H-Index - 104

eISSN - 1862-6319

pISSN - 1862-6300

DOI - 10.1002/pssa.200622176

Subject(s) - microstructure , chemical vapor infiltration , materials science , nanoscopic scale , transmission electron microscopy , silicon carbide , infiltration (hvac) , chemical engineering , composite material , chemical vapor deposition , carbide , nanotechnology , engineering

We demonstrate for the first time to our knowledge the method of temperature‐pulsing chemical vapour infiltration to process multilayered interphases of the carbon/silicon carbide composites. Transmission electron microscopy was employed to investigate the microstructure of the interphases. Finely alternate layered microstructures in nanoscale were proved to be prepared successfully via the route. (© 2006 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)

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