Premium
Microstructure of multi‐layered interphases processed by temperature‐pulsing chemical vapor infiltration
Author(s) -
Yuan M.,
Huang Zh. R.,
Dong Sh. M.,
Zhu Y. Zh.,
Jiang D. L.
Publication year - 2006
Publication title -
physica status solidi (a)
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.532
H-Index - 104
eISSN - 1862-6319
pISSN - 1862-6300
DOI - 10.1002/pssa.200622176
Subject(s) - microstructure , chemical vapor infiltration , materials science , nanoscopic scale , transmission electron microscopy , silicon carbide , infiltration (hvac) , chemical engineering , composite material , chemical vapor deposition , carbide , nanotechnology , engineering
We demonstrate for the first time to our knowledge the method of temperature‐pulsing chemical vapour infiltration to process multilayered interphases of the carbon/silicon carbide composites. Transmission electron microscopy was employed to investigate the microstructure of the interphases. Finely alternate layered microstructures in nanoscale were proved to be prepared successfully via the route. (© 2006 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)